HAD816-B（全自动高速固晶机）
（周期： 120ms）
适合于矩阵式粘胶工艺的IC支架，如DFN/QFN系列、SOP系列
一、机型特性
1.点胶模组可扩展性适应客户支架；高达4组点胶针头，大大提高了点胶效率，每组点胶机构X/Y/Z向可调整方便调试维护；
2.采用线性电机驱动搜寻晶片平台（X/Y）与送料平台（B/C）；
3.wafer table自动校正芯片位置；
4.自主研发工控机控制系统，简单易操作&维护；
5.流量式芯片真空检测，稳定可靠；
6.自主研发视觉系统for pre-bond/pos-bond，稳定可靠；
7.材料/产品的全自动载入载出，高生产效率的保证；
8.固晶位置精准及优良的一致性，高品质产品的保证；
9.节拍：120毫秒/点，实际产出取决于芯片尺寸和支架上产品的密集度；
10.bondforce参数化调整，稳定可靠。
HAD816-B（Automatic High-speed Die
Bonder）
（Cycle: 120ms）
It is compatible with IC leadframe
of matrix viscose process, such as DFN/QFN series, SOP series.
1. The dispensing module is
expandable to adapt to customer support; up to 4 sets of dispensing needles,
greatly improving the efficiency of dispensing. The Dispensing mechanism of
each set can be adjusted in X/Y/Z direction for convenient debugging and
maintenance.
2. Using linear motor to drive the
search chip platform (X/Y) and the feeding platform (B/C);
3. Wafer table automatically
corrects the position of the chip;
4. Independently developed
industrial computer control system, easy to operate and maintain;
5. Flow type chip vacuum detection,
stable and reliable;
6. Independently developed visual
system for pre-bond/ pos-bond, stable and reliable;
7. Fully automatic loading and
unloading of materials/products, ensuring high production efficiency;
8. Precise location of die bonding
and excellent consistency, guarantee high quality products;
9. Beat: 120 ms/point, actual output
depends on chip size and density of products on the bracket;
10. Bondforce parameterized adjustment,
stable and reliable.
Model Features
二、规格参数/Specifications and Parameters
|
1.系统功能/System Function |
4、吸晶摆臂机械手系统/Die Bonder’s Swing Arm-and-hand system |
||
|
生产周期 /Production Cycle |
120ms（取决于晶片尺寸及支架）(Depending On Die Size And Holder) |
吸晶摆臂/Swing Arm of Die Bonder |
bondforce参数化调整 |
|
固晶精度/Accuracy |
±1mil(±0.025mm） |
吸晶压力 /Die Bond Pressure |
可调20g-250g (Adjustable) |
|
芯片旋转/Die Rotation |
±3° |
5.送料工作平台/Loading Workbench |
|
|
2.芯片XY工作台/Die XY Workbench |
行程范围 /Range of Stroke |
300mm*100mm |
|
|
芯片尺寸 /Die Dimensions |
5mil×5mil-90mil×90mil |
XY分辨率 /XY Resolution |
0.02mil（0.5μm） |
|
6.适用支架尺寸/Suitable Holder’s Size |
|||
|
晶片最大角度修正/Max. Angle Correction |
±180° |
支架长度/Length |
150mm~ 300mm（单粘胶可做小于150mm支架） |
|
最大芯片环尺寸/Max. Die Ring Size |
10″（254mm）外径 铁环(External Diameter) Iron Ring |
支架宽度/Width |
50mm~ 100mm |
|
最大芯片面积尺寸/Max. Die Area |
8″(Expanded) |
7.所需设施/Facilities Needed |
|
|
分辨率 /Resolution Ratio |
1μm |
电压/频率/Voltage/Frequency |
220V AC±5%/50HZ |
|
顶针Z高度行程 /Thimble Z Height Stroke |
160mil（4mm） |
压缩空气 /Compressed Air |
0.5MPa（MIN） |
|
额定功率/Rated Power |
930W |
||
|
3.图像识别系统/Image Recognition System |
耗气量 /Gas Consumption |
40L/min |
|
|
灰阶度/Grey Scale |
256级灰度(Level Grey) |
8.体积及重量/Volume and Weight |
|
|
分辨率/Resolution |
656X492像素(Pixels) |
长x宽x高/Length x Width x Height |
220X120X155（不含显示器）cm |
|
图像识别精准度/Image Recognition Accuracy |
±0.025mil@50mil观测范围 (Observation Range) |
重量/Weight |
1300kg |
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